TSMC and the giant tech technology forum leader TSMC and South Korea's giant Samsung competition tend to heat up, whether in offensive technical or technical news, power has not been reduced, with the upcoming 5G era, from 7 nm to the Upgraded advanced competition process technology, of the three battles that can get the first chance.
Samsung Electronics held the Galaxy UNPACKED conference in New York at 4:00 pm, and launched the new Galaxy Note 10 and Galaxy Note 10+ handsets. But the most popular is the latest Samsung Exynos 9825 processor. Samsung has announced the processor as the "first world 7-nm EUV chip" by TSMC and Intel.
According to the world magazine, the processor chip also exhausts the competition. The three major battles are the 7nm EUV process, the 5nm parity machines competition to be launched next year, and the 3nm "envelope gate". "GAA)" GAA) technology.
Early mass production of TSMC from the 7nm process using traditional lithographic technology for the Apple A12 processor. The second generation of the 7nm process is the enhancement of a 7nm process version introduced in EUV, which is expected to be used on the latest iPhone and Huawei flagship.
However this Samsung, although the introduction of the 7-nm EUV process, but can only be considered a tragic victory, because it is only a month before TSMC. Samsung originally claimed that it would accumulate a 7-nm EUV by the end of 2018, and equip the Galaxy S10, which was launched in early 2019. As a result, when the S10 was launched, the Samsung processor was only used in a small review of the 10-. nm process, and Samsung was also allowed. The processor is behind the iPhone's generic streaming process, and it was launched six months later. In addition, due to the desire to shorten the development schedule, Samsung has chosen to relax the guidelines, the side effect being to reduce production. At the same time, Samsung has announced that it will launch a 6-nm process, which is expected to be mass-produced in the second half of the year, but performance is still a big problem.
Next up is the competition for 5G smart machines. US chip giant Qualcomm is expected to launch the first 5G mobile phone chip 7250. The process used is Samsung's "6 nm". Many domestic factories are expected to release 5G handsets using 7250 pieces before New Year's Eve next year, thus breaking Huawei's situation to monopolize the 5G market. If Samsung is unable to increase the performance of the 6nm process, the biggest beneficiary will be Taiwan MediaTek.
The 6nm pair of Qualcomm's Shanglianfa 7nm, also became the agent war between Samsung and TSMC. Qualcomm's strong pressure on MediaTek in recent years has overwhelmed them. MediaTek's "68XX" series for mid-to-high 5G handsets is claimed to be the highest performance and lowest power 5G system single chip, and is also integrated with MediaTek's exclusive development. AI processor.
In addition, TSMC fully supports the development of MediaTek, which exceeds Samsung's time frame in the 5G scrap process. Although MediaTek is expected to launch later than Qualcomm, with the foreign investment, the shipment of a 5G mid-range aircraft will explode next year. On the rise of TSMC, the outside world is also quite optimistic about MediaTek's development.
The last battle was the battle of the 3 nm process. According to market data, in the first quarter of this year, TSMC's share market share was 48.1%, and Samsung's market share was 19.1%.
To that end, Samsung has proposed a bypass strategy and announced a direct attack of 3 nanometers.Sam Samsung said in May this year that it would launch an advance 3 nanometer process GAA technology in 2021. The mass production time is 2021, which is earlier than TSMC. One year. A former TSMC supervisor has claimed that many of the big customers in the past three months have been attracted by Samsung. However, the technology has been researching for over a decade, but it was originally intended for use at 5 nm. Samsung has made a big effort and TSMC has to make a statement.
Thus, in the second quarter of the legal conference, TSMC president Wei Zhejia said he would continue to "coordinate the definition of specifications" with clients and said he would make the new choices available to the market next time. Liu Deyin, the president of TSMC, also responded. The 5 nm and 3 nm of TSMC are both "full knot shocks", indicating that the "3" of the opponent is actually closer to the "5" of TSMC.
In this case, Yan Taonan, who has worked at TSMC for more than 20 years and now serves as a vice president at Esmer, mentioned that TSMC was planning to introduce FinFET at 20 nm, but the news appeared that Samsung intends to directly reshape it to 14 nm. FinFET. TSMC can only be followed. However, the marketing department hopes to phone at 14 nm, which once forced the Intel R&D director to explain everywhere, Intel is the true 14 nm.
(China Times Newsletter)